The Peeling Test on Redux‐bonded Joints

A theoretical analysis is given of the peeling test for Redux‐bonded joints, as devised by Aero Research Ltd. and generally accepted as a standard quality control test for metal‐bonding processes. Numerical values derived from computations appear to be in reasonable agreement with experiments, but more test‐data and better knowledge of the clastic and plastic behaviour of both adhesive and adherent are necessary to make the method more reliable in this respect. The practical value of the method, however, is the indication it gives about the sensitivity of the test for the variables involved. This may make it feasible to introduce corrections for variations of some parameters, thereby improving the reproducibility of the test.