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New phosphorylated epoxy‐imide polymer was obtained using diimide‐diepoxide (DIDE) cured with bis(3‐aminophenyl)methylphosphine oxide (BAMP). In addition, composition of the synthesized diimide‐diepoxide (DIDE) with common curing agents, e.g., 4,4′‐diaminodiphenylether (DDE) and 4,4′‐diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat and flame retardation with that of bis(3‐aminophenyl)methylphosphine oxide. The reactivity of those curing agents toward epoxy‐imide, as measured by differential scanning calorimetry (DSC), was of the order DDE > BAMP > DDS. Through the evaluation of thermal gravimetric analysis (TGA), the new phosphorylated epoxy‐imide polymer demonstrated excellent thermal properties as well as a high char yield.
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Chin et al. (1995) studied this question.
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