Thermoelastic interaction between a point heat source and a circular nano-inclusion in plane deformation

The plane deformation of an elastic matrix containing a circular nano-inclusion and a nearby point heat source is examined theoretically. Comprehensive nanoscale effects of the inclusion including interface heat conduction, interface elasticity and residual interface tension are taken into account. Analytic solutions for the full thermoelastic field are derived. Numerical examples are performed to explore these interface effects together with the bulk material contrast on the von Mises stress near the inclusion-matrix interface. The results show that the interface heat conduction alleviates the interfacial stress concentration at both the matrix and inclusion side, while the residual interface tension intensifies the stress concentration at the matrix side yet reduces that at the inclusion side. In terms of the interface elasticity, it plays the role of elevating the von Mises stress concentration at both the matrix and inclusion sides. In the presence of interface elasticity, the residual interface tension has almost no effect on the stress at the matrix side but it enhances significantly the stress at the inclusion side.