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Experimental study demonstrates high-quality bulk growth of 100 mm aluminum nitride via physical vapor transport, highlighting its readiness for power and radio-frequency electronics.
Ultrawide bandgap (UWBG) semiconductors are destined to become the foundation for next-generation power and radio-frequency (RF) electronic devices. Their superior qualities such as high thermal conductivity, strong critical electric field, and robust mechanical and radiation hardness are driving continuous and widespread research. Amongst the UWBG materials, aluminum nitride (AlN) is highly attractive due to its direct ultrawide bandgap of about 6.2 eV, resulting in one of the highest Baliga’s and Johnson’s figures of merit. Equally important as its properties are material availability and growth methods capable of producing large-diameter substrates. In this work we report on bulk growth of 100 mm AlN crystals using the physical vapor transport (PVT) technique. The thermal gradients were simulated and tailored to obtain adequate thermal stresses, resulting in substrates with narrow X-ray rocking curves and dislocation densities in the range of 102–105 cm−2. In addition, the room-temperature thermal conductivity measured in two directions, perpendicular and parallel to the c-axis, was confirmed to be 300 W m−1 K−1. AlN substrates also demonstrated high UV transparency with absorption coefficients as low as 10 cm−1 at 265 nm wavelength. These results, along with the availability of 100 mm substrates, demonstrate that AlN is ready for further exploration and development for the power and RF electronics industry.
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Bondokov et al. (2026) studied this question.
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