Adhesive interface interactions between primary aliphatic amine surface conditioners and polyamic ester/polyimide resins

The interface reactions of 3‐aminopropyltriethoxysilane treated surfaces, with a polyamic alkyl ester/polyimide resin formed from pyromellitic dianhydride and oxydianiline, were defined by Fourier Transform Infrared (FTIR) analysis on the surface layers of germanium internal reflection plates. Adhesion between these interfacial layers is the result of chemical bonding, which apparently proceeds through initial amide formation between the amino function of the silylated surface and the alkyl ester group present in the polyamic ester. Heating results in diamide formation by a second alkyl, surface‐bound amine displacing the aromatic polymer amine. Heating the more stable dialkyldiamide to 300°C imidizes both the polymer and the interfacial region, producing a strong laminate composite. Polymer scission at the aromatic amide linkages occurs in this adhesion process, bonding surface‐bound alkyl amines to one end of a shortened polymer chain.