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The T1 (Al2CuLi) intermetallic compound was synthesized in bulk form for characterization of its electrochemical behavior in chloride solutions by conventional direct current (DC) techniques. Results indicated T1 was active with respect to its microstructural suroundings in artificially aged Aluminum Association (AA) 2090 (UNS A92090) (Al 2.1% Li-2.6% Cu) and preferential dissolution of T1 precipitates strongly influenced localized corrosion behavior of the alloy. Subgrain boundaries in artificially aged AA 2090 were particularly susceptible to localized attack because of high concentrations of T1. The role of T1 in preferential subgrain boundary attack in a chloride-free sulfate solution also was investigated.
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Buchheit et al. (1994) studied this question.
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