The authors describe simultaneous interfacial misfit (IMF) array formation along with antiphase domain (APD) suppression in highly mismatched (Δa0/a0=13%) AlSb grown on a 5° miscut Si (001) substrate. Strain energy from the AlSb/Si heterojunction is accommodated by a self-assembled two-dimensional array of pure 90° dislocations confined to the interface. The 13% lattice mismatch establishes the AlSb/Si IMF period of ∼3.46 nm. This IMF spacing is well matched to the step length of the 5° miscut Si (001) substrate. Furthermore, the miscut substrate geometry suppresses APD formation due to the double step height. The resulting bulk material has both very low defect density (∼7×105/cm2) and very low APD density (∼103/cm2) confirmed by transmission electron microscope images. This material is expected to be desirable for electronic III-V devices on Si substrates.
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Huang et al. (2008) studied this question.
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