A Novel Circuit Fabrication Technique Using Offset Lithography

This paper reports progress in the development of a novel fabrication technique for thin-film electronic circuit boards. The application of this work is in substitutes for resin-laminate circuit boards fabricated by photo-resist and etching processes. Circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Whilst developed primarily for low cost applications, Conductive Lithographic Films (CLFs) have now been successfully demonstrated in a range of telephone plant, microprocessor and microwave stripline applications.