This is the authors' abstract. We don't add key points for this paper.
Thin films of Al-substituted cobalt ferrite layers on thermally oxidized silicon wafers were fabricated via the sol-gel method with various annealing temperatures. Structural and magnetic properties of the films were investigated with thermogravimetric and differential thermal analysis (TG-DTA), an x-ray diffractometer, vibrating sample magnetometer (VSM), and atomic force microscopy (AFM). TG-DTA measurements showed exothermic reaction peak at 285/spl deg/C. CoAl/sub 0.2/Fe/sub 1.8/O/sub 4/ thin films that fired at and above 400/spl deg/C had a single cubic spinel structure without any preferred crystallite orientation. Lattice constants monotonically decreased from 0.8381 to 0.8354 nm with increasing annealing temperature from 400 to 800/spl deg/C. As annealing temperature increased from 400 up to 800/spl deg/C, grain size increased from 4.6 to 25.4 nm, whereas the surface roughness was minimized at 700/spl deg/C with a value of 2.0 nm. Parallel and perpendicular coercivity at room temperature showed maximum values of 1980 and 2490 Oe, respectively, in the sample annealed at 700/spl deg/C. Coercivity was shown to be strongly dependent not only on annealing temperature but also on surface roughness.
Answers are grounded in this paper and cite their sources.
No takes yet. Share an insight, caveat, or question.
Kim et al. (2002) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: