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A Novel Pretreatment Technology for Organic Low‐Dielectric Material to Suppress Copper Diffusion and Improve Ashing Resistance, Chang, Kow‐Ming, Deng, I‐Chung, Tsai, Yao‐Pin, Wen, Chan‐Yang, Yeh, Sy‐Jer, Wang, Shih‐Wei, Wang, Jin‐Yea
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Chang et al. (2000) studied this question.
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