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Post apply bake (PAB) effect understanding and control resulting to enhanced lithographic performance of two negative chemically amplified resists is demonstrated. This study is based on the measurement of the minimum time needed for the removal of the remaining after spin coating solvent using a novel interferometer tool. In the materials examined the free volume enhances the developer selectivity resulting to higher resolution and significantly improved process latitude.
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I. Raptis (2001) studied this question.
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