Multilayer and multiconductor technologies such as Si- and gallium arsenide (GaAs)- based MMICs and LTCCs have resulted in compact components. In such technologies, lumped elements can be realized easily and have become attractive in reducing the size of passive components. A compensation technique to realize compact multioctave bandwidth two-way power splitters is presented in this article.
No takes yet. Share an insight, caveat, or question.
Inder J. Bahl (2008) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: