Analysis of Concurrent Grain Growth During Creep of Polycrystalline Alumina

During low‐stress creep experiments in a fine‐grained alumina, the strain rates decreased continuously with time due to the occurrence of concurrent grain growth. The grain‐growth kinetics were independent of the applied stress and depended only on the time of exposure to the elevated test temperature. An analysis of the effect of concurrent grain growth was consistent with experimental observations.