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Variable frequency microwaves (VFM) offer a unique advantage in processing advanced materials, i.e. providing rapid, uniform and selective heating over a large volume at a high energy coupling efficiency. This has been demonstrated on industrial scales in various applications, including bonding of polymers or composite panels, curing of polymer or composite parts, drying of polymer films and preheating of polymer composites. This paper presents two bonding applications: I) bonding of polymer composites, including urethane-based SRIM (structure reaction injection molding) glass fiber composite panels and fiberglass reinforced polyester panels, for automotive applications, and 2) bonding (curing) off lip-chips (FC) for electronic packaging applications. Because VFM has the ability to provide a selective yet unifOrm heating of adhesives, this technology provides an attractive alternative to realize high-speed bonding for many industrial applications.
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Wei et al. (1998) studied this question.
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