Imprinting three-dimensional patterns directly into electrically conductive polymer blends is investigated. Silicon substrates are spin-coated by a polymethylmethacrylate/polyaniline-camphor sulfonic acid mixture dissolved in m-cresol. The patterns are imprinted using a silicon stamp having a 500 nm deep grating with 5 μm wide lines and spaces. The imprinting temperature was 140 °C, pressure 150 bar, and time 10 min. The conductivity of the blend was 1 S/cm prior to imprinting and decreased by a factor of about 2 in the process. Removing the residual film from the grooves by etching in argon/oxygen plasma results in resistance anisotropy larger than 104 perpendicular and parallel to the imprinted polymer ridges.
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Mäkelä et al. (2001) studied this question.
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