Ultrasonic measurements of surface defects on flexible circuits using high-frequency focused polymer transducers

High-frequency transducers made from a layer-by-layer deposition method are investigated as transducers for ultrasonic imaging. Prototypes of adhesive-free transducers with four active elements were made on a high-performance poly(ether imide) substrate with precision milled spherical cavities used to produce focused ultrasonic beams. The transducer prototypes were characterized using a pulse–echo experimental setup in a water tank using a glass plate as a reflector. Then, transducer was used in a three-dimensional ultrasonic scanning tank, to produce high-resolution ultrasonic images of flexible electronic circuits with the aim to detect defects in the outermost cover layer.