The influence of copper vapour on the transport coefficients in a nitrogen arc plasma

Using the method ofChapman and Enskog, the transport coefficients of a copper-nitrogen mixture at atmospheric pressure were calculated. With the most appropriate methods the authors determined the cross-sections of collisions between copper and the othe r particles. The results obtained show that at low temperatures (5000K<T<7000K) the electrical conductivity is clearly increased by the presence of copper. At higher temperatures (T approximately=15000K) the electrical conductivity of the mixture can be reduced by the presence of doubly ionised atoms of copper. The influence of the copper is also felt by the reactional thermal conductivity but has little influence on the translational thermal conductivity.