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The curing process of an unsaturated polyester was followed by employing the dynamic spring analysis (DSA) technique attached to the Rheovibron viscoelastometer. The storage and loss moduli and the gel times of the resin with various concentrations of initiator (methyl ethyl ketone peroxide) were determined at several temperatures. The activation energy for the curing process studied was about 40 kJ/mol. Temperature effects on films partially cured below the ultimate glassy transition temperature ( T g ) were studied similarly using the tensile mode on the Rheovibron from room temperature to 120°C. Two modulus peaks were observed upon heating and these were independent of precure conditions. The lower temperature peak was the result of continued curing and the higher temperature peak was attributed to the glassy relaxation of the cured product. The DSA technique were found to be useful for characterization of the curing process and the results showed good qualitative agreement with those obtained by tensile measurements using cast films when the shapes of the curves were compared.
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Yap et al. (1982) studied this question.
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