Copper (I) oxide (Cu 2 O) and copper (II) oxide (Cu 2 O 2 ) were investigated for their bondability as an interconnecting material.It was found that copper (II) oxide is more suitable than copper (I) oxide because the former is reduced at a lower temperature (345ºC) when molecular hydrogen is used as a reducing agent.A combined analysis of theoretically-calculated reduction paths, thermogravimetric/differential thermal analysis (TG-DTA) curves, and shear test results revealed that lower activation energy and higher stabilization energy for the reduction contribute to better mechanical and thermal properties of an interconnection.
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Yasuda et al. (2010) studied this question.
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