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The thermophysical and mechanical properties of a nanocomposite material composed of amine‐cured diglycidyl ether of bisphenol A (DGEBA) reinforced with organomontmorillonite clay are reported. The storage modulus at 100 °C, which was above the glass‐transition temperature (Tg), increased approximately 350% with the addition of 10 wt % (6.0 vol %) of clay. Below the Tg, the storage modulus at 30 °C increased 50% relative to the value of unfilled epoxy. It was determined that the Tg linearly increased as a function of clay volume percent. The tensile modulus of epoxy at room temperature increased approximately 50% with the addition of 10 wt % of clay. The reinforcing effect of the organoclay nanoplatelets is discussed with respect to the Tandon–Weng and Halpin–Tsai models. A pseudoinclusion model is proposed to describe the behavior of randomly oriented, uniformly dispersed platelets in nanocomposite materials.
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Miyagawa et al. (2004) studied this question.
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