The oxidation of NC 132 hot‐pressed silicon nitride in dry oxygen was studied at 1521 to 1731K. The rate of O 2 uptake and N 2 release, as a function of time, was measured volumetrically. The ratio of N 2 released to O 2 consumed was smaller than expected from the stoichiometry of the oxidation reaction for Si 3 N 4 . The low value was attributed to impurities in the material. The oxidation rate followed the parabolic law with an activation energy of 440 kJ/mol. The corrosion scales (examined by microsurface techniques) were porous due to bubbles of released N 2 . The scales consisted of a mixture of unoxidized silicon nitride grains, crystalline oxides (SiO 2 and MgSiO 3 containing other elements), and a glass phase. Reoxidation showed that the oxide scale was not protective. The magnesium profile in the subsurface layers indicated that the diffusion of magnesium in the unoxidized material was the rate‐limiting step in the oxidation.
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Cubicciotti et al. (1978) studied this question.
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