Self‐Assembly of Copper Micro/Nanoscale Parallel Wires by Electrodeposition on a Silicon Substrate

Arrays of straight copper wires can be deposited onto a silica layer (see image) by controlling the concentration of the CuSO4 electrolyte used. The copper wires are shown to contain nanograins of copper oxide, a consequence of the mechanism of their preparation. Wires with widths varying from 80 to 1200 nm suggest promise for applications in, amongst other realms, magnetic storage devices.