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An easy, cheap, high‐throughput way to generate metallic wire arrays by patterned electrodeposition is reported. Copper is electrodeposited on the surface of a regularly striped Langmuir–Blodgett film, forming an array of submicrometer‐wide wires with homogeneous width (see Figure). Width and separation of the wires can be tuned by the template.
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Zhang et al. (2004) studied this question.
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