Dielectric microwave characterizations of (Ba,Sr)TiO3 film deposited on high resistivity silicon substrate: Analysis by two-dimensional tangential finite element method

( Ba , Sr ) TiO 3 (BST) thin films were deposited on high resistivity silicon substrates by in situ rf magnetron sputtering. A buffer layer was used to improve the cristallinity of the films, the composition was fixed to Ba/Sr=30/70. The relative permittivity and the losses were measured up to 60 GHz using coplanar strip lines. The dispersion of the permittivity and the losses has been determined with a home made numerical code based on finite elements: ELFI. We show that, with the measurements of the scattering parameters coupled with ELFI, it is possible to know the BST complex permittivity over a very broad frequency band. The BST films deposited by in situ (700 °C) present excellent properties between 1 to 60 GHz. The relative permittivity is in the order of 270 and the losses are very small 0.09 at 60 GHz. These structures BST/silicon high resistivity show good potentialities for devices microwaves applications which need future integration in a silicon environment.