Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite system

BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures.