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Applications of laboratory hard X‐ray photoelectron spectroscopy on buried interfaces in devices are presented. We use a novel spectrometer fitted with a monochromated CrKα source (photon energy: 5414.9 eV) and a high‐voltage analyzer. Elements buried at depths as deep as 25 nm underneath various overlayers such as Al/Ta and Pt/Ti are detected and quantified from survey spectra, with chemical shifts accessible from high‐resolution scans. Different analysis conditions towards optimizing the information depth are presented and discussed.
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Renault et al. (2018) studied this question.
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