Size Effect of AlN on the Performance of Printed Circuit Board (PCB) Material-brominated Epoxy Resin

Many properties of brominated epoxy resin, a type of material widely used in printed circuit boards (PCBs), such as the coefficient of thermal expansion (CTE) (pre and post T g ), dielectric constant (D k ), dissipation factor (D f ), tensile strength, and Young’s modulus, have been evaluated according to size and content in terms of the weight of the aluminum nitride (AlN) filler. It has been found that the performance of epoxy resin improves significantly when AlN is used as the filler. Excellent properties were obtained when 2.3 μm AlN was added till 50 wt%; i.e., CTE (pre T g ) = 27 ppm/°C, T g = 128 °C, D f = 0.016, D k = 7.5, and Young’s modulus = 7.5 GPa. The SEM results show that the dispersion of AlN nanopowder filler is largely homogeneous.