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Nearly 100 % filling of TiO2 nanotubes with metals, including Ag, Cu, Au, and Pt, was achieved by defect-sealing treatment at the bottom of the nanotubes, followed by metal deposition using nuclei formation/coalescence. The resulting short-circuit-free interdigitated electrode configurations can, for example, be used to fabricate memristive electrodes.
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Liu et al. (2013) studied this question.
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