High-mobility nanocrystalline silicon thin-film transistors fabricated by plasma-enhanced chemical vapor deposition

Hydrogenated nanocrystalline silicon (nc-Si:H) films were deposited by using 13.56MHz plasma-enhanced chemical vapor deposition at 260°C by means of a silane (SiH4) plasma heavily diluted with hydrogen (H2). The high-quality nc-Si:H film showed an oxygen concentration (CO) of ∼1.5×1017at.∕cm3 and a dark conductivity (σd) of ∼10−6S∕cm, while the Raman crystalline volume fraction (Xc) was over 80%. Top-gate nc-Si:H thin-film transistors employing an optimized ∼100nm nc-Si:H channel layer exhibited a field-effect mobility (μFE) of ∼150cm2∕Vs, a threshold voltage (VT) of ∼2V, a subthreshold slope (S) of ∼0.25V∕dec, and an ON∕OFF current ratio of ∼106.