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In this research, a fundamental study is conducted to identify the materials and develop the processes for producing barrier/bonding composite on Bi 2 Te 3 for high temperature thermoelectric applications. The composite must meet four basic requirements: (a) prevent inter-diffusion between the electrode material, for our design, silver(Ag) and Bi 2 Te 3 , (b) bond well to Bi 2 Te 3 , (c) bond well to Ag electrode, and (d) do not themselves diffuse into Bi 2 Te 3 . The composites investigated include palladium (Pd), nickel/gold (Ni/Au), Ag, and titanium/gold (Ti/Au). After annealing at 250 °C for 200 h, only the Ti/Au design meets all four requirements. The thickness of Ti and Au, respectively, is only 100 nm. Other than meeting these four requirements, the Ti/Au layers exhibit excellent step coverage on the rough Bi 2 Te 3 surface even after the annealing process.
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Lin et al. (2011) studied this question.
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