A model based on a continuously bonded interface predicts high punching stresses at the apex of the implant and low stresses in the cortical plates. A model based on a continuously bonded interface predicts high stiffness and a resultant low implant displacement-load ratio. A model based on a tissue ingrowth-bonded interface predicts uniform distribution of stresses around the implant through the cortical plates. A model based on a tissue ingrowth-bonded interface predicts an implant displacement-load ratio close to the ratio measured with actual implant specimens.
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Weinstein et al. (1976) studied this question.
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