Prototype packages in aluminum nitride for high performance electronic systems

The way in which many standard processing techniques such as laser cutting, thick and thin film deposition, glassing and soldering can be used with aluminum nitride is illustrated, and some of the ways in which material and process compatibilities can be achieved are highlighted. The viability of such techniques is demonstrated by the production of aluminum nitride prototype packages and substrates using thick-film and thin-film technologies. Substrate preparation, package walls, lid sealing, and leads are discussed.>