Three‐Dimensional Printing of Interconnects by Laser Direct‐Write of Silver Nanopastes

A novel non-contact 3-dimensional laser direct-write process is demonstrated. Freestanding silver interconnects with various widths (8–75 μm), loop heights (1–10 μm), and bond lengths (8–100 μm) are printed on various substrates. We demonstrate the capability of this technology for ultrafine (<1 μm) pitch bonding and for connecting LEDs embedded in flexible polyimide substrates