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May 1, 2000Journal of Polymer Engineering

Rheological and Calorimetric Characterization of an Epoxy System Cured in Presence of a Reactive Polyethersulphone

Oriana Motta A. Mamo A. Recca D. Aciemo

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Abstract

Article Rheological and Calorimetric Characterization of an Epoxy System Cured in Presence of a Reactive Polyethersulphone was published on May 1, 2000 in the journal Journal of Polymer Engineering (volume 20, issue 3).

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Motta et al. (2000) studied this question.

synapsesocial.com/papers/6aa0e04037dbb9cd33997444 https://doi.org/10.1515/polyeng.2000.20.3.159

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