Multilayer thin films (3, 5 and 7) of 20% copper doped titanium dioxide (Cu:TiO2) have been deposited on glass substrates by sol-gel spin coating method. After deposition, films have been irradiated by a beam of continuous wave diode laser (532 nm) for two minutes at the angle of 45°. Structural, surface morphology and electrical properties of films have been investigated by X-rays diffraction (XRD), scanning electron microscope (SEM) and four point probe technique respectively. XRD shows the formation of titanium copper oxide. Surface morphology of thin films indicated that the average grain size is increased by increasing the number of layers. The average sheet resistivity of 3, 5 and 7 layers of thin films measured by four point probe technique is 2.2 × 104, 1.2 × 104 and 1.0 × 104 (Ohm-cm) respectively. The present study will facilitate a cost effective and environmental friendly study for several properties of materials.
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Khan et al. (2017) studied this question.
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