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This article outlines a number of inkjet-/three-dimensional (3-D)-printed prototypes of RF and millimeter-wave (mmW) components, interconnects, and systems. We pay special attention to the major challenges related to applying current multidimensional printing technologies to the fabrication of flexible multichip modules (MCMs) and high-performance mmW components.
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Bahr et al. (2017) studied this question.
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