Formation of cubic Cu mesocrystals by a solvothermal reaction

Cubic Cu mesocrystals were prepared via a facile solvothermal reaction in a mixed solvent of glycerol–water. The microstructure of synthesized mesocrystals can be successfully controlled by adjusting the volume ratio of glycerol/water. The evolution of these cubic Cu mesocrystals was investigated and the mechanism was discussed. The oriented attachment process controls the initial stage in the formation of scabbled cubic Cu mesocrystals and then Ostwald ripening process contributes to the formation of the final Cu mesocrystals by shearing the scabbled mesocrystals. The influences of reaction temperature and NaOH concentration on the morphology of the synthesized mesocrystals were also investigated. Isotropic conductive adhesives (ICA), filled with cubic Cu mesocrystals, exhibit a low bulk resistivity, of about 5.21 × 10−4 Ω cm.