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This letter presents an on-chip millimeter-wave (MMW) Yagi-Uda antenna implemented by the integrated passive device (IPD) process. This antenna consists of a half-wavelength dipole element and two director elements to achieve higher directivity than conventional wire dipole antennas and is excited using a micro-strip via-hole balun structure. Measurements indicate that the on-chip antenna achieves the bandwidth of 18% (53.8-64.8 GHz), a peak gain of 6 dBi. The simulated front-to-back ratio and radiation efficiency are 15 dB and 93%, respectively. Compared to the CMOS process, the characteristics of the designed antenna are much better. Thus, this 60-GHz chip antenna obtains a compact size of 1.5 × 1.8 mm2, high efficiency, and high-gain advantages.
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Huang et al. (2011) studied this question.
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