Synapse
⌘+K
Synapse
PulseExploreClubsResearchersJournals
Instagram
HomeClubsExplore
November 1, 1979Journal of Applied Physics

Grain-boundary diffusion of Ag through Cu films

View Full Paper
Ask AI
Bookmark
Share

Authors

JSJ. M. SchoenNTT (Japan)JPJ. M. PoateColorado School of MinesCDC. J. DohertyMurray State University

Discussion

Loading...

Member takes

Overview

Key Points

Key points are not available for this paper at this time.

Cite This Study

Schoen et al. (1979) studied this question.

synapsesocial.com/papers/6aa2405643c640b0446ee88ehttps://doi.org/10.1063/1.325842
View Full Paper
Ask AI
Bookmark
Share

Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Diffusion in Copper and Copper Alloys, Part II. Copper-Silver and Copper-Gold Systems1974 · 127 citations
  2. 2Thin-film interdiffusion. II. Ti-Rh, Ti-Pt, Ti-Rh-Au, and Ti-Au-Rh1975 · 32 citations
  3. 3Thin-film interdiffusion. I. Au-Pd, Pd-Au, Ti-Pd, Ti-Au, Ti-Pd-Au, and Ti-Au-Pd1975 · 96 citations
  4. 4Measurement of grain-boundary diffusion at low temperatures by the surface accumulation method. I. Method and analysis1979 · 90 citations
  5. 5Effect of surface condition on diffusion in thin films at low temperatures1978 · 14 citations