This work describes the development of a sensitive optical technique for noncontact and microscale temperature measurements for solid materials and devices. It employs a differential scheme to measure very small reflectivity changes due to temperature variations and then deduces the temperature through the material's reflectivity-temperature correlations. Its application and validation for temperature measurements are examined for pure silicon wafers in the temperature range from 20°C to 220°C. This technique has a much higher temperature sensitivity and spatial resolution than conventional pyrometry.
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Qiu et al. (1993) studied this question.
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