Answers are grounded in this paper and cite their sources.
Highly Reliable Cu Interconnect Using Low-Hydrogen Silicon Nitride Film Deposited at Low Temperature as Cu-Diffusion Barrier, Murata, Tatsunori, Kono, Kazushi, Tsunemine, Yoshikazu, Fujisawa, Masahiko, Matsuura, Masazumi, Asai, Koyu, Kojima, Masayuki
No takes yet. Share an insight, caveat, or question.
Murata et al. (2008) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: