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A novel bisphenol 1, 4'-bis{4-[(4-hydroxy) phenyliminomethylidene] phenoxy} benzene (BHPB), which contains azomethine moiety and flexible aromatic ether linkage, was synthesized and introduced into the curing system composed of diglycidyl ether of bisphenol A (DGEBA) and diamine.The curing behavior of DGEBA/diamine changed dramatically due to the introduction of BHPB.The resultant epoxy thermosets containing BHPB had high Tgs (127-160°C), high Td,5% (≥ 330°C) and high integral procedure decomposition temperature (IPDT) values (662-1230°C) and good flame retardancy because of their high Limiting Oxygen Index (LOI) values (above 29.5).
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Zhang et al. (2007) studied this question.
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