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June 15, 1996Physical review. B, Condensed matter

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

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HKH. K. KimKTK. N. Tu

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Kim et al. (1996) studied this question.

synapsesocial.com/papers/6aa7181e27595b7b7ae08d5bhttps://doi.org/10.1103/physrevb.53.16027
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Also Consider

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  1. 1Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu1995 · 193 citations
  2. 2Atom motions of copper dissolved in lead-tin alloys1983 · 44 citations
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