Experimental and Multiphysics Simulation of Through Glass Vias Fabricated by Laser‐Induced Method: Model Prediction and Validation

This study focuses on the critical processes involved in the fabrication of Through Glass vias (TGVs) in fused silica using a laser‐induced method. A multiphysics coupled simulation model is established, incorporating both the laser modification and subsequent KOH solution etching stages. The model comprehensively considers mechanisms such as heat conduction, solute diffusion, and chemical reaction kinetics, enabling high‐precision prediction of the via formation process. Based on the simulation, TGV structures with a diameter of 25 µm ± 1 µm and good morphological uniformity were successfully fabricated and experimentally validated, confirming the feasibility of simulation‐driven process optimization. The results provide theoretical support and a technical pathway for the controllable fabrication of TGVs in fused silica, offering significant engineering value for high‐density vertical interconnection in advanced packaging.