Study on orthogonal optimization of process parameters for SiCp/Al composite materials by WEDM

This study investigates the wire electrical discharge machining (WEDM) of SiCp/Al composites, focusing on the effects of pulse width (Ton), pulse gap (Toff), power tubes (PT), and wire speed (WS) on surface roughness (Ra) and cutting efficiency (CE). Through single-factor experiments and orthogonal testing, surface morphology analysis revealed that cracks, shedding grooves, and discharge pits significantly affect Ra, while exposed SiC particles and shedding grooves influence CE. Range analysis and ANOVA identified optimal parameters: Ra minimized to 3.98 μm (Ton = 16 μs, Toff = 80 μs, PT = 3, WS = 3) and CE maximized to 75.62 mm²/min (Ton = 24 μs, Toff = 80 μs, PT = 3, WS = 2). These findings provide critical insights for optimizing WEDM of SiCp/Al composites.