A composite field-plated Ga 2 O 3 MOSFET with highly doped ohmic-capping layer is fabricated. An output current of 20 mA mm −1 and on-resistance of 520 mΩ · cm 2 shows big improvement upon the previous experiment on similar field plated devices. The breakdown voltage is measured to be 1975 V on an L gd = 25 μ m device. At elevated temperatures, the breakdown voltage decreases to <1 kV at 130 °C, while the on-resistance and saturation current are almost unchanged. The breakdown may be limited by the dielectric liquid strength. The on-resistance is limited by high interface state density that is attributed to the thermal process during the field oxide deposition.
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Zeng et al. (2019) studied this question.
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