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GaN metal oxide semiconductor diodes were demonstrated utilizing as the gate oxide. was grown at 100°C on MOCVD grown n-GaN layers in a molecular beam epitaxy system, using a scandium elemental source and an electron cyclotron resonance oxygen plasma. based discharges were used to remove to expose the underlying n-GaN for ohmic metal deposition in an inductively coupled plasma system. Electron beam deposited Ti/Al/Pt/Au and Pt/Au were utilized as ohmic and gate metallizations, respectively. An interface trap density of was obtained with the Terman method. Conductance-voltage measurements were also used to estimate the interface trap density and a slightly higher value was obtained as compared to the Terman method. Results of capacitance measurements at elevated temperature (up to 300°C) indicated the presence of deep states near the interface.
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Mehandru et al. (2002) studied this question.
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