Early nitriding stage of evaporated-Ti thin films by N-ion implantation

The early growth stage of epitaxial titanium nitride (TiN) films, formed by implanting nitrogen ions (N2+) with 62 keV into 100-nm-thick evaporated-Ti films, was studied by transmission electron microscopy, Rutherford backscattering spectrometry and elastic recoil detection analysis. Evaporated-Ti films spontaneously absorb hydrogen (H) from the interior of the NaCl substrate, and then TiHx partially grows in addition to the hcp-Ti. The implantation of N into evaporated-Ti films expands the hcp-Ti lattice and reduces the H concentration in the evaporated-Ti film. The former induces the hcp–fcc transformation and then leads to the growth of (001)-oriented TiNy by the occupation of N in octahedral (O) sites in the fcc-Ti sublattice. The latter induces contraction of the fcc-Ti sublattice by the escape of H from (110)-oriented TiHx and then leads to the growth of (110)-oriented TiNy by the occupation in O sites of the H-escaped metastable fcc-Ti lattice by N. The nitriding mechanism of epitaxial Ti thin films is discussed.