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We have studied the effects of high-temperature anneals on sequentially deposited TlBaCaCu films in an environment containing O2 and TlOx . From Auger electron spectroscopy depth profiles, it was found that Tl was quite volatile and can be easily eliminated from the thin films after a short treatment at 830 °C. However, the Tl can be incorporated in the films after appropriate treatment.
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Denhoff et al. (1989) studied this question.
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