The morphology of the interface between a commercial epoxy prepreg resin (HexPly M18/1) and Polyetherimide (PEI) is studied. Different cure cycles prescribed by the supplier were investigated to determine the influence of temperature and pressure on interface formation. Atomic Force Microscopy (AFM) was used as the main means of investigation. A phase-separated interphase spanning 9-10μm was observed for the PEI/epoxy prepreg interface. It was found that the temperature profile of the cure cycle strongly influences the formation of this interphase. Rapid formation of these relatively large interphase areas suggests that mechanisms other than diffusion are responsible for this phenomenon.
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Heitzmann et al. (2011) studied this question.
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